Hermetic seam sealing of crystal device and MEMS
PKG: Package
Seam sealing with our equipment:
- Pin grid array（Large sized ceramic PKG）
- Hybrid IC（Large sized metal PKG）
- Optical device（PKG with glass window）
- Device for optical communication（Metal PKG）
- Custom LSI（Round shaped seam PKG
Features of the joining method
- It can be applied to hermetic sealing of packages with various shapes and sizes.
- Vacuum sealing, in addition to N2 sealing, can be made.
- As the parallel seam welding length, the welding speed and the welding interval time can be freely combined, thorough countermeasures against heat impact can be implemented.
Hermetic sealing of optical device and hybrid IC
Sample test
We will be pleased to test your sample with our proposed joining method, and return it with a report. This seam sealing sample test evaluation will be done in close cooperation and consultation with AVIO.